
Session 3647
Donald Collins, Ph.D., Manufacturing Engineering Technology,
Forouzan Golshani, Ph.D., Computer Science,
Frank Hoppensteadt, Ph.D., Math and
Electrical Engineering,
Christian Ringhofer, Ph.D., Math,
Jennie SI, Ph.D., Electrical Engineering,
Kostas Tsakalis, Ph.D., Electrical Engineering
This paper will describe the ongoing interdisciplinary research work of a group of faculty and students working within the Systems Science and Engineering Research Center at Arizona State University (SSERC) in collaboration with INTEL and Motorola.
One
of the strongest driving forces in the economy of most developed countries is
manufacturing. In the United States, one of the most important components of
this driving force is the manufacturing of semiconductors in fabrication
facilities (FAB). Not surprisingly, tremendous efforts have been expended to
reduce the art of semiconductor manufacturing to a science.
While
the improvements in scale and yield of semiconductor manufacturing has been
spectacular and are well known, the improvement in operational methods of
process flow and process scheduling have not been as impressive. The most
obvious reason for this is the inherent physical/chemical complexity of these
processes. Semiconductor manufacturing processes are hundreds of steps long,
and factories typically operate multiple processes with each one running many
product devices to serve a dynamic marketplace. Process flows are re-entrant
and the work in process can be subject to rework. Finite equipment and human
resources exhibit a wide range of variability of availability and performance.
There are batching or set-up considerations on machines that process by wafer,
by lot, or by batch.
One practical consequence of
all of this complexity is that decisions must be made on very different
time-scales. The smallest time-scale being every few minutes during floor
operations, usually about resource allocation - which step/lot combination to
run next, which down machine to repair next, and so on. The medium time-scale
of every few days or weeks, responding to market changes. To the largest
time-scale of every few months concerning process changes, design improvements,
etc. The integration of all of these operational decisions defines the
performance of the factory. The key difficulty in making these decisions lies
in the intricacy by which they affect the long- and short-term factory
performance, as well as each other.
Given the economics of FAB performance, these decisions should be based on sound systems models built on fundamental principals. Unfortunately, these important decisions are currently based on a little local data and rough rules of thumb. The main goals of this research project were:
·
To investigate novel applications and employ
proven tools from the theory of dynamical systems and from control theory to the
factory-wide resource scheduling (decision) problem and product release
generation in semiconductor manufacturing, and
·
To develop a model for university-industry
dialog in the semiconductor manufacturing area by having industry personnel and
interdisciplinary faculty and students working as active participants in the
research.
SSERC
is made up of faculty and students from across many departments and three
colleges, College of Engineering and Applied Sciences, College of Liberal Arts
and Sciences and the College of Technology and Applied Sciences. The objective
of the Center is to foster interdisciplinary research work for faculty and
students. The faculty meets at least once per week in a scheduled seminar
series where individuals and groups present their latest research. An outside
speaker is brought in from either industry or another university several times
per semester. The Center also sponsors a 1 to 2 day mini-conference per
academic year on topics of specific interest to its members. This has been an
excellent model to introduce faculty and students to new ideas for
interdisciplinary collaboration. The small group of faculty listed here is an
example of this collaboration. Each member brings his/her own expertise and
when integrated makes the total more than just the sum of the individuals.
This
interdisciplinary research encompasses hierarchical mathematical and stochastic
simulation modeling for semiconductor manufacturing, from the release of raw
wafers at the start through the completion and shipment of the devices. The
implementation of “optimal scheduling policies” has recently been recognized as
an important and challenging problem in the Semiconductor Industry2,7,18,20,45,46.
The competitive operation of modern fabrication processes requires the
development of precise rules for allocating the available resources within the
FAB so as to optimize the production performance. Although simply stated, such
an objective is elusive, primarily due to the size and complexity of modern
FABs. The determination of an optimal scheduling policy remains highly
nontrivial, involving the solution of a constrained optimization problem with
respect to often-conflicting objectives while any admissible policy must
possess certain robustness properties in the presence of uncertainty. This
research has developed hierarchical simulation modeling software tools that can
be used to manage variabilities arising on the FAB floor3,4,5,6,7,8,10,11,15,18,23,24,25,26,31,38,43.
These tools will enable managers and operators to avoid work in progress (WIP)
build-ups caused by these variabilities. We investigated the integration of
several levels of FAB flow product-release and resource-scheduling algorithms
integrated with machine process controllers, including predictive controllers
in real time (see Figure 1.) with the aid of discrete event simulation.
Intelligent
information systems are at the heart of control, processing and optimization of
semiconductor
manufacturing5,7,18,20,45. Our goals for the information support
systems integrated with the FAB Manufacturing Execution System (MES) such as
PROMISÒ
or WorkStreamÒ
and Master Database system such SAPÒ
or OracleÒ
include provisions for a knowledge-based, multi-level integrated architecture
for information flow/processing across all stages of manufacturing from oxide
growth chamber simulations through controller and supervisory levels to the
enterprise level4,5,10,11,12,13,14,15,18,26,31,36,38,39,40,41,42,43,44,45,46,47.
Specifically,
in the context of semiconductor manufacturing, data analysis and data mining
are the basis for quality control assurance, prediction of time to failure, raw
material needs, inventory control, executive report generation, etc. In the
context of our multi-level information system architecture, data analysis and
filtering must take place at all levels. Basically, raw data is modeled into a
summative form, and then passed on for use at another level. As information
travels up the hierarchy, more refined numbers and semantics are included.
The
research involved the development of effective simulation models of existing
FABs. Present plans are to extend beyond the simulation and include effective
interaction with the FABs relational databases (e.g., Motorola’s PROMISÒ
and Intel’s WorkStreamÒ).
In particular, bi-directional interfaces for all controllers, schedulers, and
release generators are being investigated (Figure 1.). There are four levels in
the hierarchy of a FAB integrated simulation model. The lowest level (level 1)
comprises machine process controllers20,31; next (level 2)
predictive controllers47,47,54,55; third (level 3) resource
schedulers3,4,5,6,7,8,19,21,22,23,26,41,42, and finally (level 4) the
product release generator22. The long-range objective of this
research is to assist FAB Managers in maintaining a stable FAB with maximum
utilization of resources and with minimum inventory in an acceptable time
frame.
Our
research was based on past and existing multidisciplinary ASU/Intel team(s) and
ASU/Motorola team(s) organized through the SSERC working on operational methods
for semiconductor manufacturing. The ASU/Intel team(s) have been working on an
Intel provided abstract problem of the FAB process and the ASU/Motorola team(s)
have been working in several FABs solving multiple scale problems from the
atomistic scale of Chemical Vapor Deposition (CVD)2,44 to machine
level controllers in diffusion and to predictive controllers for Reactive Ion
Etch (RIE)25 process to resource scheduling and product release
generators of actual FABs.
A
specific problem motivated by these predictive maintenance controllers is to
design scheduling and release policies that maintain the highest possible
performance in the presence of regular maintenance operations or, in general,
predictable equipment failures11,47. It is clear that for this to be
possible, the scheduling algorithm should exchange information with the
low-level controllers and in turn with the release policy generator. In this
respect, our goal was to investigate the type of information that needs to be
communicated. For example, based on our recent work on uncertainty
characterization in system identification, the "in-spec" operation of
the real-time controllers can be described with relatively simple and
computable measures.
While
such procedures can help in predicting potential equipment failures, the use of
this information by the scheduling and release policies remains unclear. During
our recent work we
observed
that this problem could be formulated as a time-varying control problem, for
which control theory offers a variety of tools. Our plan was to investigate the
use of Model-Based compensatory design techniques to develop and test
scheduling algorithms that provide "near-optimal" performance with
respect to large-but-low-frequency perturbations, such as predictable equipment
failures and emergency maintenance.
Intel
has provided the basic definition of the abstract problem in an operational
format. One facet has been the specification of a FAB model (see Figure 2.).
The Intel design goals for this model were:
·
to include all of the relevant features that
make semiconductor manufacturing operations difficult, and
·
to structure the model so that the features
could be included incrementally and could be increased (decreased) in magnitude
of impact.
The
features included are re-entrant flow, multiple products including test wafers,
equipment sets with variable availability from both preventive and emergency
maintenance, equipment sets that require different setups for different process
steps and products, equipment sets that batch, technicians that have
overlapping training and floor responsibility for loading and repairing
machines, a multi-cell layout, a finite capacity material handling system with
transporters and stockers, and multiple performance metrics including both
volume and speed. Another facet has been the details of how Intel would run the
modeled FAB given the current operational methods used across Intel FABs. This
model and these metrics have been encoded into a simulation-based test-bed
using the Extendâ
simulation software to provide realistic evaluation of new ideas against
Intel’s current practice.

Figure 2. Schematic
diagram of the Intel 5 machines 6 steps process flows19
Fundamentally,
the problem of scheduling of semiconductor manufacturing operations and product
release is a problem of resource allocation in the presence of uncertainty.
This can be viewed as a systems/controls problem where resources or manipulated
variables include the release of material into the FAB, production machines,
transportation systems, and operators’ etc. Uncertainty enters in several
aspects of machine and work availability, e.g., machine failures, operator
reliability, etc. In an attempt to re-cast this problem in a more tractable
form, simplified descriptions of the FAB are frequently employed (e.g., flow
models)1,16 while much of its variability is attributed to generic
uncertainty. Such a description is useful in extracting gross properties of the
manufacturing system, but its applicability is limited. In general and even in
the absence of stochastic perturbations or modeling errors, the manufacturing
systems under consideration cannot achieve the performance suggested by simple
flow models. The principal obstacles are the nonlinear dynamics caused by the
re-entrant nature, batching, and the generally nontrivial relations between the
processing, transport, and loading times. Following simulations of an
abstraction of an Intel FAB, there is strong evidence19,37 that the
dynamics of re-entrant manufacturing systems behaves chaotically, see also1,16.
Moreover, these effects become more pronounced and critical as the
manufacturing system is pushed to operate near capacity. For this reason, we
believe that an in-depth analysis of the nonlinear dynamics involved in
manufacturing systems will be crucial in the design of effective scheduling and
control systems. We propose a hierarchical approach10,43 based on
the previously mentioned time-scale decomposition between short- and long-term
objectives. We will model the fast time-scale where decisions are made at the
machine level, through detailed models that describe the nonlinear system
dynamics (“inner-loop” or “low-level” controller). The objective of the
inner-loop controller is to follow, as well as possible, commands issued by the
high-level (outer-loop) controller. Operating on a fast time-scale, it can take
into account the process nonlinear dynamics and define operating trajectories
that trade-off variability minimization, cycle-time minimization and throughput
maximization in a locally optimal way. Effectively, the inner-loop controller
allows the approximation of the system by a simpler aggregate model for which
the computation of long-term optimal scheduling strategies can be performed in
a systematic and efficient manner. The high-level decisions evolve at a slow
time-scale (e.g., daily or weekly) and are based on aggregate models aimed to
optimize the overall system performance, compensating for infrequent or low
frequency variabilities.
The
study of control-oriented modeling involves the model development of
manufacturing systems for control purposes, using techniques/ideas from linear
and nonlinear robust control theory. Here, model aggregation and
characterization of the resulting modeling error will be central in assessing
the fidelity of the predicted closed-loop performance7,8,2,10,11,15,18,25,42,43,53,54.
Motorola
has provided Ringhofer, et al, FAB data for real time control of Chemical Vapor
Deposition (CVD) processes. CVD processes a mixture of reacting gases together with
a wafer in a reaction chamber, depositing a thin film on the surface2,18,28,29,30,31,32,33,34,35.
This process is one of the fundamental processing steps in semiconductor
manufacturing. A full process simulator has been developed to enable control of
the film thickness and its morphology from external reactor set points and
allow for the extraction of parameters for higher level controllers. To
simulate simultaneously in real time the gas flow in the reactor and the
evolution of the wafer surface involves extremely challenging computational
problems, which are amenable to solutions using parallel and distributed
computer architectures.
Motorola
has provided Si, et al25, a large amount of production data for the Reactive
Ion Etching (RIE) process to study ways to monitor and control the process at
the tool level. We will systematically study the functional correlation between
in-situ sensor measurements, post process measurements and optical emission
end-point signals. One of the critical signals for this study is the optical
emission end-point trace, since in current engineering practice this signal is
used as the sole input to determine the end point of etching processes, such as
polysilicon, metal and oxide etches. This optical emission trace has embedded
in it information about the plasma, the effect of the plasma on the wafer, and
consequently, the final wafer attributes.
There
were two specific aims included in the RIE research. 1) To achieve tight real
time control over the etch time to reduce final wafer variances in remaining
and critical dimensions. 2) To provide real time correlation analysis for
"out of norm" optical emission signals in order to determine their
causes for either warnings or control. To achieve the above goals, we have
developed predictive models for the optical emission traces from real time
in-situ measurements, an optimizer to determine the main etch time that leads
to minimum variance in final wafer dimension, and an off-line analysis relating
in-situ sensors to post measurements. Si, et al performed a systematic analysis
of existing historical data to differentiate between "normal" from
"abnormal" in-situ patterns entirely based on existing/available
production data from Motorola.
An
important problem at this level was to establish the theoretical performance
limitations that are due to re-entry, batching and set-up times. For this
purpose, discrete optimization techniques were used, reminiscent of statistical
mechanics and simulated annealing, to map out boundaries of the “feasible
region.”
Here,
the results of the previous analysis will be integrated with long-term
optimization/control policies in a practical methodology for the design of
scheduling policies. This involved tools from optimal, nonlinear and
time-varying control theory23,39,45.
The
researchers investigated the novel application of proven tools from modern control
theory to the factory-wide semiconductor fabrication problem. Adopting a
hierarchical approach, their objective was to provide a general and systematic
methodology for the design of long-term, e.g., daily, scheduling and release
policies.
In particular, the main
focal point of this research revolved around the relation between low-level
control (e.g., real-time) variability and high-level control (scheduling)
performance. As shown by Flores-Goday, et al, in our recent work (and well
understood in practice, Little’s Law and Kingman’s Formula), tight low-level
control can provide a significant improvement of the variability in scheduling
operations 3,4,5,6,7,8,10,21,25,26,42. It was also evident, however,
that a suitable design of the scheduler is necessary in order to take full
advantage of the tight low-level control.
At
the second level of research, we looked into real time process scheduling
problems. As is well known, the job-shop problem is one of the NP-complete
problems. Various scheduling strategies such as FIFO, etc., have been
investigated by Collins, et al, at a Motorola FAB36,38,39,40,41,42,43.
The results were a 33.9% reduction in cycle-time over a period of six months.
The
present focuses on real time scheduling using heuristic rules 3,4,5,6,7,8,19,21,22,23,24,26,28,29,30,31,32,
33,34,35,37,38,39,40,41,42,43.
Aside from the traditional constraint optimization approaches, and heuristics,
we are presently investigating with a Ph.D. Student and a Masters Student a
computational tool based on learning. Various schedulers are taken as input to
the "intelligent" scheduler; a pattern analyzer is first used to
screen these inputs in order to figure out the correlation’s among various
input patterns. Another intelligent agent will then be used to judge whether
the performances of the known schedulers. A positive reinforcement is released
for good performance and the associated pattern is associated closer to the
schedule, otherwise a penalty will be given. By such an approach, we believe
the scheduler will learn to be smarter and smarter. We have conducted some
basic research in this form of learning. Our closed loop system has
demonstrated its improved performance over learning. Once the system is
trained, delivering a schedule should be automatic.
The
overall goal of this team of researchers will be to develop control policies
that can be evaluated by means of simulations and, eventually, results in
implementations in real FABs.
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paper).
DONALD W. COLLINS
Donald Collins is a Professor of
Manufacturing Engineering Technology, at Arizona State University East. He
received his M.S. and Ph.D. in Electrical Engineering and Computer Science from
the University of Illinois, Chicago. Dr. Collins is an international consultant
to semiconductor companies throughout the US and Japan.
FOROUZAN GOLSHANI
Forouzan Golshani is a Professor of Computer Science at Arizona State University. Dr. Golshani received a B.S. in Industrial Engineering from Arya Mehr University of Technology, Tehran, Iran, in 1976, a M.S. and Ph.D. in Computer Science in 1979 and 1982, respectively, from Warwick University, England. He has authored 120 papers and nine US patents.
FRANK HOPPENSTEADT
Frank Hoppensteadt is a Professor with a
joint appointment in Mathematics and Electrical Engineering at Arizona State
University. He is also the Director of Systems Science and Engineering Research
Center. Dr. Hoppensteadt received a B.S. in Mathematics and Physics from Butler
University in 1960, and a Ph.D. in Mathematics from the University of Wisconsin
in 1965. Dr. Hoppensteadt is author and co-author of many books and several
patents.
CHRISTIAN
RINGHOFER
Christian Ringhofer, is a Professor in
Mathematics at Arizona State University. Dr. Ringhofer received a B.S. in
Mathematics from the Technical University of Vienna in 1978, a M.S. in Computer
Science in 1980 from Technical University of Vienna, and a Ph.D. in 1981 from
the Technical University of Vienna, Austria.
JENNIE SI
Jennie Si is an Associate Professor of Electrical
Engineering at Arizona State Universtiy. Dr. Si received a B.S. in 1985 from
Tsinghua Unviersity, an M.S. in 1988 from Tsinghua University as well, and a
Ph.D. from the University of Notre Dame in 1991.
KOSTAS TSAKALIS
Kostas Tsakalis is an Associate Professor
of Electrical Engineering at Arizona State University. Dr. Tsakalis received
a B.S. in Ch.E. from NTUA, Greece, in
1983, M.S. in Ch.E. in 1984, E.E. in 1985, and a Ph.D.in E.E. in 1988, all
from USC.